设备介绍  Equipment introduction:

       • 共用DIP和SMT两种产品
          Share DIP and SMT products;

       • 包含插端、装耳扣、接地片、电测、激光印字、贴麦拉、CCD检测、下孔板及软硬盘共用包装等；

          Includes Socket/Attachment and Grounding Plate/Electrical Measurement ,Laser Printing, Meyer, CCD Detection, Lower Hole board and soft hard dist;

       • 共分插端、组装、检包三部分连成生产线，每台机台有单独的存放半成品机构，当其中有任何一台需要停机，另外两台可继续生产，提高嫁动率；

          The shree parts of the split/assembly/inspection are connected into a production line, and each machine has a separate semi-finished mechanism for storage. If any one needs to stop, the other two can continue to prduce and increase the rate of marriage ; 

       • 为配合SMT型产品，端子铆配有独立的参数式调整压入深度。

          In ouder to match the SMT type products ,the terminal rivet is equipped with an independent parameterized pressure-regulating depth.